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Job Title Job Type Work Place Operation
崗位職責:
1.跟蹤客戶,提供技術支持,解決客戶在應用中遇到的問題.
2.了解客戶的需要,并適當地根據客戶的需要進行應用設計.
3.不斷的進行對產品的了解及相關技術的學習.
4.了解市場的動向,及競爭對手對于產品的信息.
5.配合公司內市場人員提供市場推廣技術支持.

Job Description:
1.Tracking customer’s project and providing technical support, solving the issues raised by customer during the project cycle.
2.Learning the requirements from customer and providing customized developing according to the priority.
3.Keeping studying company’s new products and the relevant technology.
4.Tracking the market trends and learning the spec of competitors’ products.
5.ooperating with marketing specialist to promote company’s new products to market.

任職要求:
1.電子工程或相關專業本科及以上學歷.
2.了解基于ARM處理器的SOC架構,熟悉高速總線,DDR,PCIe控制器,GMII/SGMII,MIPI以及各種標準低速外設接口。
3.三年以上高速數字電路系統集成設計開發經驗,熟練使用2種以上EDA原理圖設計工具。
4.熟悉電路板性能和功耗評估以及熱效率分析。
5.具備配合BSP軟件工程師定位調試問題能力
6.具備良好的問題分析能力,溝通能力和團隊合作意識,車載電子行業工作經驗者優先。

Job requirements:
1.Bachelor’s degree or above on electronic engineering or similar major background.
2.Having knowledge on ARM based SOC architecture, being familiar with high-speed digital bus design, including DDR4, PCIe, GMII/SGMII, MIPI and other popular standard low-speed peripheral interfaces.
3.Over 3 years’ developing experience on high-speed digital circuit integration design, being proficient in at least 2 kinds of schematic design EDA tools.
4.Having knowledge on board level performance/power consumption/thermal analysis.
5.Having capability of trouble shooting with BSP software engineer together.
6.Excellent communication skills and teamworking spirit, experienced with vehicle electronic developing is a plus.
崗位職責:
1.跟蹤客戶,提供技術支持,解決客戶在應用中遇到的問題.
2.了解客戶的需要,并適當地根據客戶的需要進行應用設計.
3.不斷的進行對產品的了解及相關技術的學習.
4.了解市場的動向,及競爭對手對于產品的信息.
5.配合公司內市場人員提供市場推廣技術支持.

Job Description:
1.Tracking customer’s project and providing technical support, solving the issues raised by customer during the project cycle.
2.Learning the requirements from customer and providing customized developing according to the priority.
3.Keeping studying company’s new products and the relevant technology.
4.Tracking the market trends and learning the spec of competitors’ products.
5.ooperating with marketing specialist to promote company’s new products to market.

任職要求:
1.電子工程或相關專業本科及以上學歷.
2.了解基于ARM處理器的SOC架構,熟悉高速總線,DDR,PCIe控制器,GMII/SGMII,MIPI以及各種標準低速外設接口。
3.三年以上高速數字電路系統集成設計開發經驗,熟練使用2種以上EDA原理圖設計工具。
4.熟悉電路板性能和功耗評估以及熱效率分析。
5.具備配合BSP軟件工程師定位調試問題能力
6.具備良好的問題分析能力,溝通能力和團隊合作意識,車載電子行業工作經驗者優先。

Job requirements:
1.Bachelor’s degree or above on electronic engineering or similar major background.
2.Having knowledge on ARM based SOC architecture, being familiar with high-speed digital bus design, including DDR4, PCIe, GMII/SGMII, MIPI and other popular standard low-speed peripheral interfaces.
3.Over 3 years’ developing experience on high-speed digital circuit integration design, being proficient in at least 2 kinds of schematic design EDA tools.
4.Having knowledge on board level performance/power consumption/thermal analysis.
5.Having capability of trouble shooting with BSP software engineer together.
6.Excellent communication skills and teamworking spirit, experienced with vehicle electronic developing is a plus.

崗位職責:
1.跟蹤客戶,提供技術支持,解決客戶在應用中遇到的問題.
2.了解客戶的需要,并適當地根據客戶的需要進行應用設計.
3.不斷的進行對產品的了解及相關技術的學習.
4.了解市場的動向,及競爭對手對于產品的信息.
5.配合公司內市場人員提供市場推廣技術支持.

Job Description:
1.Tracking customer’s project and providing technical support, solving the issues raised by customer during the project cycle.
2.Learning the requirements from customer and providing customized developing according to the priority.
3.Keeping studying company’s new products and the relevant technology.
4.Tracking the market trends and learning the spec of competitors’ products.
5. Cooperating with marketing specialist to promote company’s new products to market.

任職要求:
1.計算機或相關專業本科及以上學歷.
2.堅實的C語言開發能力并能讀懂數字電路原理圖設計邏輯。
3.了解基于ARM處理器的SOC架構,熟悉高速總線,DDR,PCIe控制器,GMII/SGMII,MIPI以及其它各種標準低速外設接口。
4.5年以上嵌入式系統軟件設計開發經驗,至少2年以上BSP支持經驗或者硬件驅動開發經驗。
5.熟悉bootloader以及流程,熟悉Linux 內核,有FreeRTOS應用開發經驗者優先。
6.熟悉開源社區GIT并能熟練應用相關工具。
7.具備良好的問題分析能力,溝通能力和團隊合作意識,車載電子行業工作經驗者優先。


Job requirements:
1.Bachelor’s degree or above on computer science or similar major background.
2.Solid C language knowledge and being capable to understand the digital schematic design logic.
3.Having knowledge on ARM based SOC architecture, being familiar with high-speed digital bus design, including DDR4, PCIe, GMII/SGMII, MIPI and other popular standard low-speed peripheral interfaces.
4.5+ years’ developing experience in embedded system and at least 2+ years’ experience in BSP supporting and driver developing.
5.Being familiar with bootloader, Linux kernel and being experienced with FreeRTOS is a plus.
6.Being familiar with open source community and the tools.
7.Excellent communication skills and teamworking spirit, experienced with vehicle electronic developing is a plus.

崗位職責:
1.跟蹤客戶,提供技術支持,解決客戶在應用中遇到的問題.
2.了解客戶的需要,并適當地根據客戶的需要進行應用設計.
3.不斷的進行對產品的了解及相關技術的學習.
4.了解市場的動向,及競爭對手對于產品的信息.
5.配合公司內市場人員提供市場推廣技術支持.

Job Description:
1.Tracking customer’s project and providing technical support, solving the issues raised by customer during the project cycle.
2.Learning the requirements from customer and providing customized developing according to the priority.
3.Keeping studying company’s new products and the relevant technology.
4.Tracking the market trends and learning the spec of competitors’ products.
5. Cooperating with marketing specialist to promote company’s new products to market.

任職要求:
1.計算機或相關專業本科及以上學歷.
2.堅實的C語言開發能力并能讀懂數字電路原理圖設計邏輯。
3.了解基于ARM處理器的SOC架構,熟悉高速總線,DDR,PCIe控制器,GMII/SGMII,MIPI以及其它各種標準低速外設接口。
4.5年以上嵌入式系統軟件設計開發經驗,至少2年以上BSP支持經驗或者硬件驅動開發經驗。
5.熟悉bootloader以及流程,熟悉Linux 內核,有FreeRTOS應用開發經驗者優先。
6.熟悉開源社區GIT并能熟練應用相關工具。
7.具備良好的問題分析能力,溝通能力和團隊合作意識,車載電子行業工作經驗者優先。


Job requirements:
1.Bachelor’s degree or above on computer science or similar major background.
2.Solid C language knowledge and being capable to understand the digital schematic design logic.
3.Having knowledge on ARM based SOC architecture, being familiar with high-speed digital bus design, including DDR4, PCIe, GMII/SGMII, MIPI and other popular standard low-speed peripheral interfaces.
4.5+ years’ developing experience in embedded system and at least 2+ years’ experience in BSP supporting and driver developing.
5.Being familiar with bootloader, Linux kernel and being experienced with FreeRTOS is a plus.
6.Being familiar with open source community and the tools.
7.Excellent communication skills and teamworking spirit, experienced with vehicle electronic developing is a plus.

Position Description:
The key responsibility for the position is to debug andbring up the ATE testprogram and release to mass production, including testplan definition, ATE related HW design, ATE program debugging and productionramp up.

The position requires the candidate working closely with SOCdesign/verification/validation and OSATs.

主要工作職責為開發ATE測試程序并release到封測廠進行量產, 包括測試方案撰寫,ATE相關硬件設計,ATE程序開發和debug 量產導入等。

本職位要求ATE測試工程師能與SOC設計,驗證人員以及外包供應商(OSAT以及其他相關測試服務供應商等)協同工作進行開發。

Required Skills:
3+ years working experience as ATE Engineer
Solid knowledge of ATE Testmethodologies and ProgramDevelopment

Capability of IP level testplan development, especially analog IP andphy IP related testplan development.

Experience on major ATE platforms such as Advantest V93k, TeradyneUltra Flex, J750, etc.

Capability of ATE related HW(Loadboard/socket/probecard) design &review

Well management with outsourcing vendors

Strong problem-solving skill and good schedule keeper
Good team player

3年以上ATE 工作經歷

深入理解ATE測試原理及程序開發

具備獨立撰寫testplan的能力,尤其是analog IPphy IPtestplan

具有主要ATE平臺的開發經歷,如愛德萬V93k 泰瑞達 Ultra Flex, J750

具有ATE相關硬件(Loadboard/socket/probecard)的設計和review經驗

具有良好的供應商管理能力,團隊協作能力,問題解決能力,按期交付能力


Education Requirement:
- B.Sc and above degree from China top universitieswith major on EE, Micro Electronic,
Information Engineering, Telecommunication, orAutomation etc

畢業于電子,微電子,信息科學等相關專業

Job Description:

該職位是基于ARM處理器的基礎上進行SoC的驗證工作。主要目標是為解決汽車SoC提供解決方案和產品。入職人員需要從事與SoC設計/驗證,平臺設計等工作并和產品團隊緊密合作,主要是負責SI高速信號測試驗證,并具備可以保證產品研發階段可測性需求分析評估和定位硬件測試故障分析的能力,工程師將在芯擎研發團隊工作。


主要職責:

- 與EE、layout、ME合作,評估,滿足產品性能的高速信號疊層、走線、互連方案。

- 對高速信號電路設計器件選型layout走線給出理論經驗方案 ,并可以對USB23/PCIE/DP/DSI/CSI/DDR等高速信號進行SI/PI仿真(可選)。

- 芯片bench高速IO特性分析與驗證。

- 制定產品SI測試計劃,保質保量完成SI測試如USB23/PCIE/DP/DSI/CSI/DDR等高低速信號測試,

以及可以解決SI問題,改善電路設計。

- 主要推動協調內部SI問題解決,可以推動各部門解決SI問題,保證項目進度。

- 實驗室設備控制與測試自動化的開發

- 有SI/PI仿真能力者和硬件工程師背景更佳。

- 具備一定的腳本編寫能力。

Job Requirements:

- 數學、電子、通信、信號處理、自動控制、模式識別等相關專業本科及以上學歷。 

- 熟練使用SI測試設備: 示波器,VNA網絡分析儀, TDR,誤碼儀(BERT)等。 

- 熟練掌握USB23/PCIE/DP/DSI/CSI/DDR等高速信號的一致性測試。

- 熟悉信號完整性及傳輸等理論。 

- 具有配合硬件工程師查找高速信號設計出現的問題,并通過SI仿真提出解決方案的能力。

- 具有負責高速信號眼圖調參,優化物理層性能的能力。

- 具備嵌入式軟件開發經驗者優先。

- 中國一流大學計算機科學、電子信息工程或自動化專業本科及以上學歷。


Job Description:

This position needs candidate to have software development knowledge on NPU driver, framework and optimization under Android and etc. The candidate should be familiar with one of MobileNet,ShuffleNet, DeepLab solution from user’s perspective. The position requires the candidate working closely with SOC design and verification, platform design and product team to work out the solution, including bare-metal, BSP driver and application framework.

Job Requirements:

1.      B.Sc and above degree from China top universities with major on Computer Science,EE or Automation etc.

2.      3+ years of software development in automotive, embedded system or mobile.

3.      Solid knowledge on ARM architectures,especially ARMv8, Cortex R and Cortex M.

4.      Solid knowledge of machine learning,deep learning and other AI algorithms.

5.      Strong programming skill in NPU, GPU and etc.

6.      Familiar with deep learning frameworks, such as Caffe/Tensorflow.

7.      Experienced in Samsung, Qualcomm, Renesas automotive platform development is a plus.

8.      Knowledge of ISO 26262 and function safety is a plus.

9.      Independent research ability, strong sense of responsibility.

Job Description:

This position needs candidate to have software development knowledge on NPU driver, framework and optimization under Android and etc. The candidate should be familiar with one of MobileNet,ShuffleNet, DeepLab solution from user’s perspective. The position requires the candidate working closely with SOC design and verification, platform design and product team to work out the solution, including bare-metal, BSP driver and application framework.

Job Requirements:

1.      B.Sc and above degree from China top universities with major on Computer Science,EE or Automation etc.

2.      3+ years of software development in automotive, embedded system or mobile.

3.      Solid knowledge on ARM architectures,especially ARMv8, Cortex R and Cortex M.

4.      Solid knowledge of machine learning,deep learning and other AI algorithms.

5.      Strong programming skill in NPU, GPU and etc.

6.      Familiar with deep learning frameworks, such as Caffe/Tensorflow.

7.      Experienced in Samsung, Qualcomm, Renesas automotive platform development is a plus.

8.      Knowledge of ISO 26262 and function safety is a plus.

9.      Independent research ability, strong sense of responsibility.

Job Description:

負責芯擎車載平臺的圖像渲染等graphic開發和調試

Job Requirements:

1. 具有2年以上手機或嵌入式系統底層軟件開發調試經驗.

2. 熟練掌握C/C++/JAVA編程及系統調試方法.

3. 具有Linux, Android下的驅動和系統開發調試經驗.

4. 具有OpenGL ES, Vulkan, OpenCL等編程和調試經驗.

5. 熟悉主流GPU架構和開發,如ARM Mali GPU, IMG GPU系列等.

6. 熟悉ARM架構和編程,如ARMv8, Cortex ACortex M.

7. 有高通、三星、瑞薩、MTK等芯片的車載平臺開發經驗優先.

8. Screen Sharing、虛擬化開發經驗者優先.

9. 良好的學習溝通能力和問題分析解決能力,有責任心.

Job Description:

建立影像實驗室。

建立ISP tuning的方案,流程,標準等規范。

車載參考開發平臺上camera效果調試。

車載平臺相機效果調試軟件開發,維護與優化。Camera相關算法優化。

支持客戶車載Camera效果調試。

Job Requirements:

2年以上相機效果調試經驗,有車載相機效果調試經驗者優先。

熟悉影像實驗室搭建,維護和管理。

熟練使用平臺效果調試工具,可獨立完成單顆sensor模組+ISP效果調試。

 熟悉ISP圖像處理流程和3A算法。

熟悉Android/Linuxcamera軟件架構,可分析和定位圖像效果相關的問題,熟悉V4L2結構以及Android Camera架構者優先。

能對ISP算法進行優化和定制者優先。

本科及以上學歷,較強的學習能力;善于溝通,良好的團隊協作能力。

Job Description:

The position needs to be the lead or developer for embedded software such as driver, middleware,framework and application. The candidate should be familiar with Arm A, R or Marchitecture. The candidate should have solid C/C++ development skills and debugging skills of GDB or Trace32. The position requires the candidate working closely with BSP team to work out the solution from the bare-metal to driver and to application framework. 

Job Requirements:

1.      B.Sc and above degree from China top universities with major on Computer Science, Electronic Information Engineering, Telecommunication, EE or Automation etc

2.      5+ years of software development in automotive, embedded system or mobile.

3.      Solid knowledge/skills C/C++and Linux/Posix.

4.      Solid knowledge on ARM architectures (v8- A, R or M)

5.      Experiences in U-Boot, DTS,Linux kernel, network protocols, file system and Linux driver development.

6.      Experiences in Linux ALSA,V4L2, DRM and etc.

7.      Proven track record of success in Linux/Android Graphics/MM framework .

8.      Multi-threading programming experience (pthreads).

9.      At least one Hands-on programming experience with MM, Network, Audio.

10.   Experiences on Android HAL integration, HW accelerator driver development and integration.

11.   Proven debugging experiences on system and application with gdb and other system tools.

12.   Good to follow software development flow, version control and bug tracking with GIT, Jenkins, Bugzillaor Jira.

Job Description:

The position needs to be the lead or developer for embedded software such as driver, middleware,framework and application. The candidate should be familiar with Arm A, R or Marchitecture. The candidate should have solid C/C++ development skills and debugging skills of GDB or Trace32. The position requires the candidate working closely with BSP team to work out the solution from the bare-metal to driver and to application framework. 

Job Requirements:

1.      B.Sc and above degree from China top universities with major on Computer Science, Electronic Information Engineering, Telecommunication, EE or Automation etc

2.      5+ years of software development in automotive, embedded system or mobile.

3.      Solid knowledge/skills C/C++and Linux/Posix.

4.      Solid knowledge on ARM architectures (v8- A, R or M)

5.      Experiences in U-Boot, DTS,Linux kernel, network protocols, file system and Linux driver development.

6.      Experiences in Linux ALSA,V4L2, DRM and etc.

7.      Proven track record of success in Linux/Android Graphics/MM framework .

8.      Multi-threading programming experience (pthreads).

9.      At least one Hands-on programming experience with MM, Network, Audio.

10.   Experiences on Android HAL integration, HW accelerator driver development and integration.

11.   Proven debugging experiences on system and application with gdb and other system tools.

12.   Good to follow software development flow, version control and bug tracking with GIT, Jenkins, Bugzillaor Jira.

職位描述:

該職位負責芯擎汽車類芯片(下一代智能駕駛芯片,智能座艙芯片,高性能車規微處理器等)SOC架構設計。

崗位職責:

1、 根據車規芯片產品規格定義SOC芯片架構以及模塊微架構設計。

2、 負責芯片架構層面的PPA優化。

3、 負責分析業務特點,推動軟硬件協同設

4、 負責系統性能測試和競爭性分析。

5、 負責解決芯片設計實現過程中的技術問題,確保關鍵規格的達成

任職要求:

1、 計算機,電子工程、微電子或相關專業,碩士及以上學歷

2、 熟悉基于ARM處理器的SOC架構,熟悉總線、DDR、PCIe控制器以及各種標準外設接口,熟悉SOC前后端開發流程,熟悉性能和功耗評估;

3、 7年以上SOC開發經驗,2年以上架構設計經驗

4、 熟悉Verilog和C語言,了解VMM/OVM/UVM驗證方法學

5、 熟悉Linux操作系統和Synopsys/Cadence/Mentor各種前端設計EDA工具如Spyglass, DC, PT, VCS等。

6、 具備軟硬件聯合開發調試經驗者優先考慮

7、 有汽車類芯片SOC整合設計或架構設計

?

Job Description:

該職位負責芯擎汽車類芯片(下一代智能駕駛芯片,智能座艙芯片,高性能車規微處理器等)SOC架構設計。

1、 根據車規芯片產品規格定義SOC芯片架構以及模塊微架構設計。

2、 負責芯片架構層面的PPA優化。

3、 負責分析業務特點,推動軟硬件協同設

4、 負責系統性能測試和競爭性分析。

5、 負責解決芯片設計實現過程中的技術問題,確保關鍵規格的達成

Job Requirements:


計算機,電子工程、微電子或相關專業,碩士及以上學歷

熟悉基于ARM處理器的SOC架構,熟悉總線、DDRPCIe控制器以及各種標準外設接口,熟悉SOC前后端開發流程,熟悉性能和功耗評估;

 7年以上SOC開發經驗,2年以上架構設計經驗

 熟悉VerilogC語言,了解VMM/OVM/UVM驗證方法學

 熟悉Linux操作系統和Synopsys/Cadence/Mentor各種前端設計EDA工具如Spyglass, DC, PT, VCS等。

具備軟硬件聯合開發調試經驗者優先考慮

有汽車類芯片SOC整合設計或架構設計經驗者優先考慮。

良好的應用能力、溝通能力和團隊精神

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Job Description:

該職位負責芯擎汽車類芯片(下一代智能駕駛芯片,智能座艙芯片,高性能車規微處理器等)SOC架構設計。

1、 根據車規芯片產品規格定義SOC芯片架構以及模塊微架構設計。

2、 負責芯片架構層面的PPA優化。

3、 負責分析業務特點,推動軟硬件協同設

4、 負責系統性能測試和競爭性分析。

5、 負責解決芯片設計實現過程中的技術問題,確保關鍵規格的達成

Job Requirements:


計算機,電子工程、微電子或相關專業,碩士及以上學歷

熟悉基于ARM處理器的SOC架構,熟悉總線、DDRPCIe控制器以及各種標準外設接口,熟悉SOC前后端開發流程,熟悉性能和功耗評估;

 7年以上SOC開發經驗,2年以上架構設計經驗

 熟悉VerilogC語言,了解VMM/OVM/UVM驗證方法學

 熟悉Linux操作系統和Synopsys/Cadence/Mentor各種前端設計EDA工具如Spyglass, DC, PT, VCS等。

具備軟硬件聯合開發調試經驗者優先考慮

有汽車類芯片SOC整合設計或架構設計經驗者優先考慮。

良好的應用能力、溝通能力和團隊精神

Staff Style

Elite managers in the industry closely work together in SiEngine

Staff Style Work Environment
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